Casio Micronics Develops Cost-Saving PCB Technology
August 19, 2005
Casio Micronics recently announced it has developed a new technology to produce PCBs (Printed Circuit Board), which reduces sizes of holes on PCBs by 80% by using a YAG (Yttrium Aluminum Garnet) laser instead of a carbon gas laser. If holes are smaller, more space is created to etch circuits on the board. Also, the new technology prevents foam from forming on the PCBs in the copper plating stage, reducing the width of the copper layer by approximately 40%.
The company stated that it will establish a prototype production line at its Ome plant at a cost of 200 million Yen in September 2005. It is aiming to generate revenue of 10 billion Yen over the coming five years by licensing the technology to LCD and semiconductor makers. Casio Micronics estimates the new technology will be able to bring down production costs of applications such as mobile phones and PCs by 30% to 40%.